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		<title>涂层的 on Ultra-Performance IR Heating</title>
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				<title>用于半导体的镀金红外灯</title>
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				<pubDate>Sat, 20 Jun 2026 05:42:59 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-ultra.com/images/0a976f8a438e1a813cc995e9355a4471.png&#34; alt=&#34;用于半导体的镀金红外灯&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在芯片制造过程中，烘烤温度只要偏差0.5摄氏度，就足以导致芯片的尺寸出现纳米级的变化，进而使产品的合格率下降。所谓的“软烘烤”和“硬烘烤”，其实并不是简单的加热步骤而已，它们实际上决定了整个光刻流程中的热量控制参数。&lt;/p&gt;</description>
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